![]() For example, ultrahigh purity SiC is required to make kiln furniture for use during the manufacture of semiconductor devices. SiC components are used in standard applications-which do not require high purity SiC-and in applications which require high purity and even ultrahigh purity SiC. Silicon carbide (SiC) is superior for use in such applications because SiC is chemically and mechanically more stable than polysilicon or quartz at high temperatures. RBSC components are increasingly replacing polysilicon or quartz components in many high temperature applications. RBSC components are used in many different applications, including kiln furniture, mechanical seals, burner nozzles, radiant tubes, and heating elements. The invention is particularly useful in forming high purity RBSC components, such as diffusion components for a semiconductor diffusion furnace. The invention relates to reaction bonded silicon carbide (RBSC) components, especially those used in heating furnaces. 21, 2013, the entire contents of which are incorporated herein by reference. ![]() This application claims the benefit of U.S.
0 Comments
Leave a Reply. |